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W25Q16V
Table of Contents
1.
2.
3.
4.
5.
6.
7.
GENERAL DESCRIPTION ......................................................................................................... 5
FEATURES ................................................................................................................................. 5
PIN CONFIGURATION SOIC 208-MIL ....................................................................................... 6
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM ........................................................ 6
PIN CONFIGURATION SOIC 300-MIL ....................................................................................... 7
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1
7.2
7.3
7.4
7.5
7.6
Package Types ............................................................................................................... 8
Chip Select (/CS) ............................................................................................................ 8
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
Write Protect (/WP) ......................................................................................................... 8
HOLD (/HOLD) ............................................................................................................... 8
Serial Clock (CLK) .......................................................................................................... 8
8.
9.
BLOCK DIAGRAM ...................................................................................................................... 9
FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1
SPI OPERATIONS ....................................................................................................... 10
9.1.1
9.1.2
9.1.3
9.1.4
Standard SPI Instructions ...............................................................................................10
Dual SPI Instructions ......................................................................................................10
Quad SPI Instructions .....................................................................................................10
Hold Function .................................................................................................................10
9.2
WRITE PROTECTION .................................................................................................. 11
9.2.1
Write Protect Features ....................................................................................................11
10.
CONTROL AND STATUS REGISTERS ................................................................................... 12
10.1
STATUS REGISTER .................................................................................................... 12
10.1.1
10.1.2
10.1.3
10.1.4
10.1.5
10.1.6
10.1.7
10.1.8
BUSY ............................................................................................................................12
Write Enable Latch (WEL) ............................................................................................12
Block Protect Bits (BP2, BP1, BP0) ..............................................................................12
Top/Bottom Block Protect (TB) .....................................................................................12
Sector/Block Protect (SEC) ..........................................................................................12
Status Register Protect (SRP1, SRP0) .........................................................................13
Quad Enable (QE) ........................................................................................................13
Status Register Memory Protection ..............................................................................15
10.2
INSTRUCTIONS ........................................................................................................... 16
10.2.1
10.2.2
10.2.3
Manufacturer and Device Identification .........................................................................16
Instruction Set Table 1 ..................................................................................................17
Instruction Set Table 2 (Read Instructions) ...................................................................18
-2-
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